CFC: Smart Manufacturing Innovation and Transformation: Interconnection and Intelligence

CALL FOR CHAPTER PROPOSALS
Proposal Submission Deadline: Jan 15, 2013
Smart Manufacturing Innovation and Transformation: Interconnection and Intelligence
A book edited by Dr. Zongwei Luo (University of Hong Kong, Hong Kong, China)

To be published by IGI Global: http://www.igi-global.com/requests/details.asp?ID=870

Introduction
Fast advances in information technology (RFID, sensor, Internet of things, and the Cloud) have led to a smarter world vision with ubiquitous interconnection and intelligence. Smart manufacturing refers to advanced manufacturing with wise adoption of information technologies throughout end to end product and service life-cycles, capturing manufacturing intelligence for wise production and services. Smart manufacturing represents a field with intense competition in this century of national competitiveness.

Objective of the Book
This book will provide a forum of innovative findings in advanced manufacturing research and development. It aims to promote an international knowledge exchange community involving multidisciplinary participation from researchers, practitioners, and academicians with insight addressing issues in real life problems towards smarter manufacturing. By disseminating latest developments in smart manufacturing innovation and transformation in manufacturing upon current and/or emerging technology opportunities and market imperatives, this book covers both theoretical perspectives and practical approaches for smart manufacturing research and development triggered by ubiquitous interconnection and intelligence, enabling manufacturing innovation and transformation.

Target audience
This book will provide a forum of innovative findings in advanced manufacturing research and development. It aims to promote an international knowledge exchange community involving multidisciplinary participation from researchers, practitioners, and academicians with insight addressing issues in real life problems towards smarter manufacturing. The target audience would include multidisciplinary participants from society, industry, academia, and government.

Recommended topics include, but are not limited to, the following:

* Business models and mechanism design
* Big data computing and intelligence
* Transparent and service computing
* Social and human centric computing
* Robotics and automation
* SCM/Logistics for advanced manufacturing
* MEMS/Hybrid systems for advanced manufacturing
* E-commerce for advanced manufacturing
* Manufacturing intelligence
* Manufacturing sustainability
* Digital and additive manufacturing
* RFID/Internet of Things and cloud computing
* CAD/CAM/CAE/CAPP
* PLM/ERP/CRM
* Structural health monitoring

Submission Procedure
Researchers and practitioners are invited to submit on or before January 15, 2013, a 2-3 page chapter proposal clearly explaining the mission and concerns of his or her proposed chapter. Authors of accepted proposals will be notified by February 15, 2013 about the status of their proposals and sent chapter guidelines. Full chapters are expected to be submitted by April 15, 2013. All submitted chapters will be reviewed on a double-blind review basis. Contributors may also be requested to serve as reviewers for this project.

Publisher
This book is scheduled to be published by IGI Global (formerly Idea Group Inc.), publisher of the Information Science Reference (formerly Idea Group Reference), Medical Information Science Reference, Business Science Reference, and Engineering Science Reference imprints. For additional information regarding the publisher, please visit www.igi-global.com. This book is anticipated to be released in 2014.

Important Dates
January 15, 2013:                Proposal Submission Deadline
February 15, 2013:                Notification of Acceptance
May 15, 2013:                Full Chapter Submission
June 30, 2013:                Review Results Returned
August 15, 2013:                Final Chapter Submission
September 15, 2013:                Final Deadline

Inquiries and submissions can be forwarded electronically (Word document) or by mail to the Editor:
Zongwei Luo
E-mail:
zwluo@eti.hku.hk
Land mail:
University of Hong Kong
Level 3, Block A, Cyberport 4, 100 Cyberport Road, Hong Kong _______________________________________________
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